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Niobium round targets are used in various high-tech applications, primarily in the field of thin film deposition processes such as sputtering or physical vapor deposition (PVD). Niobium, like tantalum, is known for its unique set of properties, including high melting point, corrosion resistance, and excellent conductivity.
Products | Size（mm） | Grade Nos | Specification |
Niobium & Niobium Slab | （1~2.5）×（8~300）×L | R04200, R04210 | ASTM B393 |
（2.5~6）×（20~1000）×L | |||
（6~20）×（20~1000）×L |
Niobium sputtering targets provide exceptional advantages: high purity ensures superior thin film quality, outstanding corrosion resistance guarantees longevity in harsh environments, and low thermal expansion minimizes stress during deposition. As a trusted niobium products company, manufacturers in this field continue to develop advanced materials with excellent compatibility across various coating techniques, making them ideal for semiconductor, optical, and superconductive applications.
| Processing Step | ore PrCoduction Description |
| Raw Material Prep | High-purity niobium powder (>99.95%) is selected as raw stock to produce qualified niobium sputtering target, ensuring stable sputtering performance for finished NB target. |
| Powder Treatment | Single niobium powder is loaded into ball mill for full homogenization with matched ball-to-powder ratio, the base for dense blank of standard niobium target. |
| Compacting Forming | Uniform powder is molded and pressed by CIP/HIP. CIP makes preliminary blank; HIP improves compactness for high-spec niobium sputtering target. |
| Vacuum Sintering | Green blanks are sintered in vacuum furnace to remove inner pores and raise density, customized temperature & time based on the size of each NB target. |
| Precision Machining | Sintered niobium blank is lathed & ground to reach exact dimension and surface finish required for commercial niobium target. |
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