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Titanium targets are one of the commonly used targets for preparing thin-film materials, and they are widely used in magnetron sputtering technology. They are needed in industries such as integrated circuits, decorative coatings, and flat-panel displays. Therefore, the quality of titanium targets is very important, as only good titanium targets can prepare qualified PVD coatings.
To produce qualified titanium sputtering target, purity is an important performance indicator. The purity of titanium targets significantly affects the performance of the sputtered coating. The higher the purity of the titanium target, the fewer impurity element particles in the sputtered titanium film, resulting in better PVD coating performance, including better corrosion resistance and electrical and optical properties. However, in practical applications, the purity requirements for titanium targets vary depending on their specific uses. As the cathode source in sputtering, the impurity elements and pores in the material are the main sources of contamination for the deposited film. Pores are largely removed during the non-destructive testing of ingots; any remaining pores can cause discharge during sputtering, thus affecting film quality. The content of impurity elements can only be reflected in the full elemental analysis test results; the lower the total impurity content, the higher the purity of the titanium target.
Density is also an important factor in measuring the quality of titanium targets. To reduce the porosity in the target solid and improve the performance of the sputtered film, high density is usually required for the target material. The density of the target not only affects the sputtering rate but also the electrical and optical properties of the film. The higher the target density, the better the performance of the film. Moreover, increasing the density and strength of the target can help it better withstand the thermal stress during the sputtering process. Density is also one of the key performance indicators for targets.
Typically, sputtering targets have a polycrystalline structure, with grain sizes ranging from a few micrometers to a few millimeters. For the same target material, the smaller the grain size of the titanium sputtering target, the faster the sputtering rate. Additionally, targets with smaller grain size differences can sputter films with more uniform thickness. Research has shown that if the grain size of a titanium target is controlled to be below 100μm, and the variation in grain size is maintained within 20%, the quality of the sputtered films can be significantly improved.
Metal titanium has a hexagonal close-packed structure. During sputtering, titanium target atoms tend to sputter preferentially along the direction of the hexagonal close-packed arrangement. Therefore, to achieve a higher sputtering rate, the sputtering rate can be increased by modifying the crystalline structure of the target. The crystalline orientation of the titanium target also significantly impacts the uniformity of the film thickness.
Structural uniformity is also a key indicator of the quality of titanium sputtering target. For titanium targets, it is required that the composition, grain orientation, and average grain size be uniform both on the sputtering plane and in the normal direction to the sputtering surface. Only in this way can the titanium target produce a titanium film with uniform thickness, reliable quality, and consistent grain size throughout its service life.
As a manufacturer of titanium sputtering target, Aulister deeply understands the importance of these factors on film quality. We use advanced production processes and strict quality control systems to ensure that each titanium sputtering target has high purity, high density, uniform grain structure, and optimized crystalline orientation. In fields such as integrated circuits, decorative coatings, and flat-panel displays, Aulister's titanium sputtering target provides reliable solutions for customers.
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